July 6, 2026
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Broadcom said that it will provide new custom chips to Apple Inc. in an expanded partnership that now runs through 2031.Under the new agreement, the companies will partner on ASIC silicon, short for application-specific integrated circuit. These types of chips will be found in “multiple generations of Apple products,” according to a Broadcom filing on Monday.
ASIC chips, silicon developed for a specific purpose, are increasingly vital to the development of components for processing artificial intelligence-related tasks. Apple is working on more advanced AI servers that the company is planning to deploy as early as 2027, Bloomberg has reported.
Broadcom has long made components for Apple related to cellular connectivity, Wi-Fi and Bluetooth, but that relationship has taken a step back in recent years with Apple developing its own N1 chip, a combined Wi-Fi and Bluetooth component found in recent iPhones, iPads and Macs.
On this episode, Carol Massar and guest host Emily Graffeo speak with:
Mark Gurman, Bloomberg News Managing Editor for Global Consumer Tech on Broadcom, Apple Expand Partnership to 2031 With Custom Chips
Rudina Seseri, Glasswing Ventures Founder and Managing Partner AND Ed Ludlow, Bloomberg Tech Host on state of AI and AI investment landscape
Dr. Ellen Wald, President of Transversal Consulting AND Senior Fellow at the Atlantic Council AND Author of "Saudi, Inc." on Saudis Slash Main Oil Price to Rare Discount as Market Dives
Eric Roston, Bloomberg News Sustainability Editor on Extreme Weather Tops Scientists' Most Dire Climate Predictions
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Carol Massar and Tim Stenovec bring together the latest news from the world of business and finance and the interesting stories of global technology, politics, economics and more by harnessing the power of Bloomberg Businessweek reporters and editors.
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