Huawei AI Chips Contain Advanced Parts From Rivals | Bloomberg Tech 10/3/2025
October 3, 2025
12,959
181
20
1.55%
Search the Record
IndexedEvery word spoken in this episode is indexed. Type any phrase to jump straight to the moment it was said.
Type any word or phrase that may have been spoken. Click a result to seek the player to that exact moment.
Try a name, a topic, or a quoted line
Bloomberg Technology Episodes Around October 3, 2025
See what was published immediately before and after this episode.
44:03Now PlayingHuawei AI Chips Contain Advanced Parts From Rivals | Bloomberg Tech 10/3/2025
YouTube Description
as posted by the channelBloomberg’s Caroline Hyde and Ed Ludlow discuss findings that Huawei's Ascend AI processors contain advanced components from TSMC, Samsung, and SK Hynix. Plus, Rivian is reworking the manual release on its vehicle doors after employees and customers raised concerns over potential safety issues. And Beijing dangles the promise of investments in the US as it pushes President Donald Trump to reverse national-security restrictions on Chinese deals.
--------
Like this video? Subscribe to Bloomberg Technology on YouTube:
Watch the latest full episodes of "Bloomberg Technology" with Caroline Hyde and Ed Ludlow here:
Get the latest in tech from Silicon Valley and around the world here:
Connect with us on...
Follow Ed Ludlow on X here
Follow Caroline Hyde on X here
Listen to the daily Bloomberg Technology podcast here:
More from Bloomberg Business
Connect with us on...
Guests & Subjects Covered
Sentinel Indexing in Progress
Metadata and chapters are available. Claim extraction for this episode is pending.
All video content is delivered via YouTube embedded players in accordance with the YouTube Terms of Service. Sentinel provides research tools that promote discovery and accountability across political media.









